Synthesis of Novel Catalytic Materials using Atomic Layer Deposition

John M. Vohs, PhD
University of Pennsylvania

Abstract: Atomic Layer Deposition (ALD) has emerged as a powerful technique for synthesizing thin films with precise control over structure and composition. While traditionally employed in the electronic materials industry for producing conformal films on silicon wafers and other planar supports, ALD's capabilities have recently expanded into the realm of heterogeneous catalyst synthesis and modification. In this presentation I will explore the use of ALD in catalytic materials synthesis, showcasing recent studies from our research group. The talk will begin with an overview of the ALD process, emphasizing the necessary modifications needed for application to high surface area supports. I will then discuss our use of this technique in the following three areas: (1) Oxide Thin Films on High Surface Area Supports: I will demonstrate the growth of perovskite (e.g., CeFeO3) and spinel (e.g., CuMn2O4) oxide thin films on γ-Al2O3 supports and discus the catalytic activity of these materials and their potential as supports for noble metal catalysts. (2) Single Metal Atom Catalysts: I will introduce a modified ALD technique as an efficient method for synthesizing single metal atom catalysts, highlighting the potential of ALD for atomic scale precision in catalyst design. (3) Conformal Films on Carbon Supports: I will also show examples in which ALD was used to synthesize conformal metal oxide films on high surface area carbon supports, with a focus on potential applications in electrocatalysis.